Europe 3D Semiconductor Packaging market By End-User

germany accounted for the largest market share in 2017 in the europe 3d semiconductor packaging market, and is expected to reach usd 2480.55 million in 2023 from usd 1054.21 million in 2017.this market is projected to grow at a cagr of 15.30% during the forecast period from 2018 - 2023. through silicon via tsv segment accounted for the largest market share in 2017, this market is expected to reach usd 2490.36 million in 2023 from usd 1284.27 million in 2017. this market is projected to grow at a cagr of 11.67% during the forecast period from 2018 - 2023. however, package on package segment is the fastest growing market, which is expected to grow at a cagr of 15.53% during the forecast period 2018 - 2023. 3d sip segment accounted for the largest market share in 2017, this market is expected to reach usd 1766.72 million in 2023 from usd 949.30 million in 2017. this market is projected to grow at a cagr of 10.86% during the forecast period from 2018 - 2023. however, 3d ic segment is the fastest growing market, which is expected to grow at a cagr of 15.68% during the forecast period 2018 - 2023. consumer electronics segment accounted for the largest market share in 2017, this market is expected to reach usd 2011.75 million in 2023 from usd 950.12 million in 2017. this market is projected to grow at a cagr of 13.31% during the forecast period from 2018 - 2023. however, telecommunication segment is the fastest growing market, which is expected to grow at a cagr of 14.67% during the forecast period 2018 - 2023.