Asia Pacific 3D Semiconductor Packaging market By End-User

china accounted for the largest market share in 2017 in the asia pacific 3d semiconductor packaging market, and is expected to reach usd 10529.89 million in 2023 from usd 3077.55 million in 2017.this market is projected to grow at a cagr of 22.79% during the forecast period from 2018 - 2023. 3d sip segment accounted for the largest market share in 2017, this market is expected to reach usd 6836.84 million in 2023 from usd 2492.16 million in 2017. this market is projected to grow at a cagr of 18.41% during the forecast period from 2018 - 2023. however, 3d ic segment is the fastest growing market, which is expected to grow at a cagr of 19.97% during the forecast period 2018 - 2023. consumer electronics segment accounted for the largest market share in 2017, this market is expected to reach usd 6587.14 million in 2023 from usd 2390.97 million in 2017. this market is projected to grow at a cagr of 18.45% during the forecast period from 2018 - 2023. however, military and aerospace segment is the fastest growing market, which is expected to grow at a cagr of 20.47% during the forecast period 2018 - 2023. through silicon via tsv segment accounted for the largest market share in 2017, this market is expected to reach usd 8057.55 million in 2023 from usd 3132.88 million in 2017. this market is projected to grow at a cagr of 17.12% during the forecast period from 2018 - 2023. however, package on package segment is the fastest growing market, which is expected to grow at a cagr of 20.92% during the forecast period 2018 - 2023.