Market Size (2017)
2017
$72.46M
Vertical: SEMIBase Year: 20189 Sections
Market Size (2017)
2017
$72.46M
Projected (2023)
2023
$328.59M
CAGR (2017–2023)
28.7%
28.7%Key Players
107+
DRAM is a type of random-access memory that can store data which involves periodic upgrades. The data stored on a DRAM chip depends upon the applied voltage. The data storage capacity (density) of DRAM is measured in kilobit, megabit, or gigabit. The advent of DRAM witnessed the domination of US-based companies; though, gradually Japanese companies took leadership owing to the government support and efficient production process. However, in recent years, various regions in China (including Taiwan) have witnessed the production and supply of DRAM solutions.
The various factors attributing to high adoption of these DRAM solutions are growing number of smartphones and tablets, rise in demand for network storage systems and server applications, and use of DRAM solutions in IoT-related components. Furthermore, high-bandwidth memory requirement for artificial intelligence (AI) and machine learning applications drive the need for DRAM chips. The major buyers of DRAM solutions are technology companies such as Facebook Inc., Google and Amazon and smartphone manufacturers such as Apple Inc., Huawei Technologies Co., and Xiaomi Corp. among others.
This study on the global DRAM market provides detailed information on industry trends and dynamics, market size, competitive landscape, and growth opportunities. This research report categorizes the DRAM market by type, technology, application, and region/country. Based on type, the market is segmented into synchronous DRAM, Burst Extended Data Output (BEDO), Extended Data Output (EDO), asynchronous DRAM, and FPM (Fast Page Mode). The technology segment includes DDR4, DDR3, DDR5/GDDR5, and DDR2. The applications of DRAM covered in the study are PCs/laptops, mobile phones, gaming consoles, and networking devices. The regions included in the study are North America, Europe, Asia-Pacific, and the rest of the world.
By type, the Synchronous DRAM (SDRAM) segments hold the largest market share and is expected to register the highest CAGR during the forecast period owing to the high operating performance and speed. Most laptops and PC’s have SDRAM as the main system memory. By technology, the largest market share is estimated to be held by DDR4 that is a curved edge technology which makes easier to put into slot and remove memory chip from slot, however, the upcoming DDR5/GDDR5 technology is expected to register the highest CAGR during the forecast period. By application, PC/laptop segment dominated the market in terms of market share and is expected to exhibit the highest growth rate during the forecast period. By region, Asia-Pacific is the most significant contributor and it is expected to grow with the fastest CAGR from 2018 to 2023. China (including Taiwan) followed by Japan dominates the market in both demand DRAM solutions, whereas, China (including Taiwan) and South Korea lead in the global supply of DRAM solutions.
The DRAM market is highly competitive with the presence of many vendors that offer feature-rich and innovative memory solutions to their customers. The major vendors profiled in the study are Samsung Electronics Co. Ltd (South Korea), SK Hynix Inc. (South Korea), Micron Technology, Inc. (US), Transcend Information, Inc. (Taiwan), Powerchip Technology Corporation (Taiwan), Nanya Technology Corporation (Taiwan), Winbond Electronics Corporation (Taiwan), Kingston Technology Corporation (US), Integrated Silicon Solution Inc. (US) and ATP Electronics, Inc. (Taiwan).
The market players are adopting several organic and inorganic growth strategies, such as product enhancement, product launch, partnership, agreement, and collaboration to improve their position and excel in the global DRAM market. In December 2018, Micron Technology, Inc. and Wi-LAN Inc. had signed a license agreement with Powerchip Technology Corporation for the patents related to DRAM and semiconductor process technologies. In the same year, Nanya Technology Corporation acquired Formosa Advanced Technology Co. Ltd. to strengthen the DRAM products testing and packaging.
The DRAM Market market is projected to grow at a CAGR of 28.7% from 2017 to 2023.
Historical performance and future projections (2020–2030, USD Billion)
Subscribe to Wantstats
Unlock premium reports, insights, blogs, charts and more.
View Subscription PlansMarket Size (USD Mn)
Subscribe to Wantstats
Unlock premium reports, insights, blogs, charts and more.
View Subscription PlansDynamic RAM (DRAM) is a type of random-access memory which stores information in each bit form on a separate capacitor. In static RAM (SRAM), the data is stored using a static method, in which data remains constant if electricity is supplied to the memory chip. Therefore, a DRAM holds or stores more data than an SRAM chip of the same size. DRAM stores the data efficiently because it requires less physical space to store the same amount of data than if it is stored statically. The DRAM can be categorized as fast page mode (FPM), external data output (EDO), burst extended data output (BEDO), asynchronous DRAM, and synchronous DRAM (SDRAM).
Subscribe to Wantstats
Unlock premium reports, insights, blogs, charts and more.
View Subscription PlansSubscribe to Wantstats
Unlock premium reports, insights, blogs, charts and more.
View Subscription PlansSubscribe to Wantstats
Unlock premium reports, insights, blogs, charts and more.
View Subscription PlansThis report applies a rigorous multi-stage research process combining primary interviews, secondary data sources, and bottom-up market modelling to ensure accuracy and completeness across all segments and geographies.
Base Year
2018
Historical Period
2017 – 2018
Forecast Period
2018 – 2023
Primary Interviews
150+
Historical data (2017–2018) and forecast period (2018–2023)
Our research process spans primary interviews with industry stakeholders combined with comprehensive secondary data analysis, validated through triangulation across multiple independent sources.
Subscribe to Wantstats
Unlock premium reports, insights, blogs, charts and more.
View Subscription PlansThreat of New Entrant
The threat of new entrants in the DRAM industry is low due to extremely high capital requirement, economies of scale, and cross-patent agreements by established players.
The two vital stages for creating value from cost leadership and differentiation are design and fabrication. Both these stages require huge capital investments. Also, there is a need for highly skilled workforce which adds to the overall cost. As a result, the high capital investment makes the barriers to entry high. Moreover, economies of scale is also a challenge for new entrants as the industry demands large-scale production for them to gain a cost advantage. Furthermore, the DRAM industry has a significant number of cross-licensed agreements that pose a high barrier to the new entrants. For instance, the patent licensing agreement of October 2018 between Rambus and Phison. In the agreement, Rambus licensed Phison to use a wide range of innovations in the Rambus patent portfolio.
Bargaining Power of Supplier
DRAM market is cyclic, therefore, the supply lead times decide the revenue for the DRAM providers. The equipment quality and the supply lead times are the key factors for developing and producing new generations of DRAM. Furthermore, due to the high order cancellation cost and market consolidation, there is high vendor lock-in and the switching cost for buyer is also very high. As a result, the bargaining power of suppliers is likely to remain high in the DRAM industry during the forecast period.
Bargaining Power of Buyers
The end-users of DRAM are consumer electronics manufacturers that cover almost 70 to 80 % of the DRAM market. The end-users are corporate customers whose end-product largely depend on the supply of DRAM chips. Therefore, the bargaining power of buyer is expected to remain moderate in the years to come.
Threat of Substitute
For DRAM, the threat of a substitute is quite low because the likelihood of the availability of a substitute with the exact same function is almost negligible. Although technological change is continuous with the entry of substitute products such as phase-change memory. However, the fundamental limitation of these products restricts it from replacing the DRAM chip during the forecast period. Furthermore, the buyer’s propensity for the substitute is very low.
Intensity of Rivalry
The industry is growing at a significant rate. Over the past decade, the market has been consolidated by established players. A few active vendors in the market account for a cumulative market share of more than 70%. Furthermore, there is intense competition among the players in the market, with the vendors investing heavily in extensive research and development to make advancement in the technology, resulting in high degree of rivalry in the market.
Market estimates by geography (2023)
InsightAsia Pacific leads with $160.82M by 2023.
Subscribe to Wantstats
Unlock premium reports, insights, blogs, charts and more.
View Subscription Plans| REGION | 2017 | 2018 | 2023 | CAGR | SHARE |
|---|---|---|---|---|---|
| North America | $20.70M | $43.55M | $92.36M | 28.3% | 28% |
| Europe | $14.46M | $28.56M | $57.23M | 25.8% | 17% |
| Asia Pacific | $31.42M | $71.32M | $160.82M | 31.3% | 49% |
| Rest of the World | $5.88M | $10.32M | $18.18M | 20.7% | 6% |
| Total | $72.46M | $153.75M | $328.59M | 28.7% | 100% |
Subscribe to Wantstats
Unlock premium reports, insights, blogs, charts and more.
View Subscription PlansTotal Market Size
$328.60M
| APPLICATION | REVENUE ($B) | GROWTH RATE | MARKET PENETRATION |
|---|---|---|---|
| Synchronous DRAM | $128.35M | 28.7% | 54% |
| BEDO (Burst Extended Data Output) | $70.69M | 28.7% | 89% |
| Asynchronous DRAM | $53.14M | 28.7% | 88% |
| EDO (Extended Data Output) | $46.22M | 28.7% | 78% |
| FPM (Fast Page Mode) | $30.20M | 28.7% | 85% |
* Revenue projections based on 2025 estimates. Growth rates represent CAGR 2024–2030. Market penetration indicates current adoption rate within addressable market segments.
Subscribe to Wantstats
Unlock premium reports, insights, blogs, charts and more.
View Subscription PlansSee plans for professionals or small and medium businesses.

Analytical insights on DRAM Market covering market dynamics, competitive landscape, and strategic outlook.
The DRAM Market market is projected to reach $328.59M by 2023, growing at 28.7% CAGR. The Synchronous DRAM segment holds the largest share.
With global urbanization and advances in technology, the adoption of consumer electronics such as laptops/tablets, smartphones and digital cameras has increased manifold.
According to Zenith’s Mobile Advertising Forecasts, by 2019, the global smartphone penetration will reach nearly 66%, with mobile devices accounting for 73% of global internet consumption. The major factor contributing to the growing demand is the increasing population, rise in per-capita disposable income, and easy availability of high-speed internet and end-use products at low cost.
The growing smartphone usage has increased the demand for handsets with high processing capabilities, low-power-consumption with high storage capacity. This has consequently fuelled the demand for DRAM. Therefore, the growing production of smartphones with high processing and enhanced memory capabilities is expected to drive the market during the forecast period.
Internet of Things (IoT) is defined as an environment where the connectivity of computer and networks extend to different electronic devices such as mobiles, computers, electric meters, televisions, air conditioners, and others. The IoT environment allows the devices to exchange, consume, and generate data with little human intervention.
IoT adoption has been witnessed across various sectors including automotive, industrial, and infrastructure among others. This has led to the development of connected cars, intelligent factories, smart homes and buildings, smart cities, and smart farms among others. With each of these developments comes vast amount of data that require high-end data processing capabilities with a differentiated storage portfolio. As a result, there is a growing demand for fast, reliable, and cost-effective high-density DRAM solutions. In 2018, Innodisk Corporation launched a high-performance, wide-temperature server-ready DRAM — DDR4 WT RDIMM VLP — to meet the future AI and IoT challenges.
Conclusively, the DRAM market is expected to advance its development pace to meet the amplified memory capabilities in the coming years.
DRAM manufacturing process offers a competitive edge to the leading DRAM manufacturers. DRAM fab is usually a billion-dollar chip-fabrication plant that converts raw silicon wafers into integrated circuits. The fabrication process includes plating of DRAM circuits on silicon wafer by designed masks. This overall process includes multiple detailed sub-processes across different equipment. The cost incurred in fabrication is largely due to the investment in lithography equipment and technology to shrink the line width. Furthermore, DRAM manufacturers also do not have the option of outsourcing the foundry services as the DRAM fabrication process demands coordination of design and process engineers. This makes the DRAM manufacturing a highly capital-intensive task.
Due to the high development cost, the overall cost of end-product is also high. Furthermore, over the years the end-users of DRAM have shifted from corporate customers to consumer segments that demand low-cost DRAM cores. Furthermore, unlike corporate customers that demand mass production of standard products, the consumer segment includes diverse end-use applications that increases the fabrication cost which is expected to restrain the market growth in the coming year.
Near-term growth will likely concentrate in modular bioreactor lines and closed-system media workflows that shorten validation cycles while preserving batch traceability.
Partnerships between CDMOs and instrumentation vendors should accelerate standard datasets for comparability across sites, improving forecasting models used in capacity planning.
Longer horizon, organoid and microphysiological adoption may reshape segment mix; teams that invest early in assay interoperability and cloud QC hooks are better positioned to capture upside without fragmenting their analytics stack.
Profiles of 107 companies operating in the DRAM Market market, including revenue, employee count, and market positioning where available.
Showing 107 of 107 companies
Integrated Silicon Solution Inc.
Company Headquarters: US Founded: 1988 Workforce: ~ 590 Company Working: Integrated Silicon Solution Inc. designs, manufactures, and markets integrated circuits for communications, industrial/medical automotive, and digital consumer, and other applications. The company’s products include dynamic random-access memory (DRAM), mobile DRAM, wafer level memory solutions, static random-access memory, and flash. Additionally, the company also provides analog and mixed-signal integrated circuits that include audio amplifiers, LED drivers, voltage converters, HBLED drivers. The company operates in the US, Taiwan, Hong Kong, India, China, Japan, Korea, Singapore, and Europe.
ATP Electronics Inc.
Company Headquarters: Taiwan Founded: 1991 Workforce: ~500 Company Working: ATP Electronics Inc. (ATP Electronics) is a semiconductor manufacturer and offers NAND flash and DRAM memory modules. The company operates through the memory cards, SSDs, managed NAND, flash memory, and DRAM module segments. The memory cards segment consists of industrial SD cards, industrial microSD cards, industrial CFast cards, and CompactFlash industrial grade. The SSDs segment includes products, namely M.2 NVMe, M.2 SATA, 2.5”SSD, mSATA, slim SATA, and eUSB and USB drivers. The managed NAND segment consists of e.MMC. The DRAM module consists of DDR4, DDR3, DDR2, DDR1, SDRAM.
SK Hynix Inc.
Company Headquarters: South Korea Founded: 1983 Workforce: ~10,000 Company Working: SK Hynix Inc. manufactures and sells semiconductor products globally. The company provides memory semiconductor products such as flash memory chips (NAND Flash), dynamic random-access memory chips (DRAM), and CMOS image sensors (CIS). The company operates in the US, Europe, and Asia among other regions. SK Hynix Inc. operates through its subsidiary in the US, the UK, Germany, Singapore, Hong Kong, India, Japan, Taiwan, and China. The company was formerly known as Hynix Semiconductor Inc. and changed its name to SK Hynix, Inc. in 2012.
Kingston Technology Corporation
Company Headquarters: US Founded: 1987 Workforce: ~500 Company Working: Kingston Technology Corporation (Kingston Technology) manufactures and supplies digital media and memory products. The company provides system-based products such as hard drives for consumers, businesses, enterprises, and system builders, ValueRAM, and HyperX memory products, DataTraveler USB drives, DRAM modules, flash cards, such as photo/video cards, mobile devices, high-end photo cards, and card and wireless readers. Additionally, Kingston Technology also provides supply chain management and contract manufacturing services for system OEMs and semiconductor manufacturers in the US and globally. The company has manufacturing facilities in Taiwan, the US, and China.
Nanya Technology Corporation
Company Headquarters: Taiwan Founded: 1995 Workforce: ~650 Company Working: Nanya Technology Corporation manufactures, designs, and sells dynamic random-access memory (DRAM) products for different applications. The company operates in various regions and countries including Europe, the Americas, Japan, Korea, China, and Taiwan. The company’s products include standard DRAM, multi-chip package DRAM, Known Good Die (KGD), Low Power DRAM, and automotive and industrial DRAM’s. The products have wide application in office and enterprises, homes, portable devices, and mobiles; these are also used in the industrial and automotive sectors.
Powerchip Technology Corporation
Company Headquarters: Taiwan Founded: 1994 Workforce: ~200 Company Working: Powerchip Technology Corporation (Powerchip Technology) is a Taiwan based company that manufactures and sells logic and memory products to the semiconductor industries in Taiwan and globally. The company provides technologies and services such as open foundry business services, design services, manufacturing services, memory wafer test services and process technology. Moreover, the company also provides open foundry technologies and products such as low power DRAM, LCD drivers, power management ICs, integrated memory chips, and others. Additionally, the company provides manufacturing, design, and memory wafer test service.
Powering the world's best teams.
From next-gen startups to established enterprises.
Trusted by forward-thinking businesses
for data-driven intelligence
DRAM Market