SemiconductorJul 15, 2026

Siliconware Precision Industries Co. Ltd

Company Profile Analysis

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Siliconware Precision Industries Co. Ltd - Semiconductor showcase

Year Founded & Workforce

1983-12-31

24,000 Employees

Industry

Semiconductor

Services

Siliconware Precision Industries Co. Ltd Overview

Company Headquarters: Taiwan

Founded: 1984

Workforce: ~24,000

Company Overview: Siliconware Precision Industries Co. Ltd (SPIL) is engaged in the provision of semiconductor packaging, assembly, testing, and bumping services. Its assembly services include IC packaging processes for chipsets. SPIL also provides in-house design and consultation services. The company's test services are used to validate the assembly process by utilizing testing solutions for a range of digital and mixed signal devices. The bumping services include direct bumping, re-passivation, redistribution, wafer level CSP, and gold bumping services. Apart from this, the company offers packaging and testing solution including substrate packages and lead-frame packages with either wire bond or flip chip interconnections. The company also uses technologies such as wafer thinning, wire bonding, stacked-die bonding, wafer bumping, fine-pitch, and flip-chip assembly for developing packages including quad- plastic ball grid array (PBGA), thin and fine-pitch ball grid array (TFBGA), stacked-die chip scale package (CSP), flat no-leads (QFN), wafer level chip scale package (WLCSP), memory card, and flip chip ball grid array (FCBGA). The application of these packages could be observed in personal computers, consumer products, hand-held products, and wire communications. The company’s product portfolio comprises ball grid array, chip scale, stacked die, memory cards, and quad and dual leaded packages. The company's subsidiaries include SPIL (B.V.I.) Holding Limited, Siliconware US Inc., SPIL (Cayman) Holding Limited, and Siliconware Technology (Suzhou) Limited. Geographically, the company offers its solutions to the US, China, Taiwan, Europe, and other regions.

Company Snapshot

$2.385M

Revenue

24,000

Employees

1983-12-31

Founded

Taiwan

Headquarters

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About the Author

Wantstats Research Team

Wantstats' research desk profiles Siliconware Precision Industries Co. Ltd as part of our ongoing coverage of the Semiconductor sector, drawing on public company data, filings, and market intelligence.

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I am very pleased with how market segments have been defined in a relevant way for my purposes (such as "Portable Freezers & refrigerators" and "last-mile"). In general the report is well structured. Thanks very much for your efforts.

Rob Kooiker

Group Product Manager HVAC & Fire Protection GMA, Rockwool

I have been reading the first document or the study, the Global HVAC and FP market report 2021 till 2026. Must say, good info! I have not gone in depth at all parts, but got a good indication of the data inside!

Jason Lee

R&D Director, Seojin

Thanks for your great support. Appreciate it. Well received report. It helps us to understand market well. We're planning other area of survey in the future, let's keep in touch.

Akif Moroglu

Strategy & Business Development Director, Dogan Holding

We got the report in time, we really thank you for your support in this process. I also thank to all of your team as they did a great job.

Noah Malgeri

Co-Founder, Mojave Rail Fabrication Limited

This is really good guys. Excellent work on a tight deadline. I will continue to use you going forward and recommend you to others. Nice job.

Michael Robert

Manager, JavolVision

Thanks, I am so happy that we worked together. Maybe we still can work together in the future.

Joseph Aguayo

Sales Operations & Pricing Manager, Intel

Thanks. It's been a pleasure working with you, please use me as reference with any other Intel employees.

Bong Lau

Sales Leader, Bamberg

We bought your "2025 report" in 2020. Everything is fine and very good.

Peter Groot Koerkamp

Account and Business Manager, EFS-Holland BV

Thanks for sending the report it gives us a good global view of the Betaïne market.

Younghwan Choi

Senior Retail Manager, LG Chem

We found the report very insightful! we found your research firm very helpful. I'm sending this email to secure our future business.

Mark Irwin

Management Consultant, Level 21

I am very pleased with how market segments have been defined in a relevant way for my purposes (such as "Portable Freezers & refrigerators" and "last-mile"). In general the report is well structured. Thanks very much for your efforts.

Rob Kooiker

Group Product Manager HVAC & Fire Protection GMA, Rockwool

I have been reading the first document or the study, the Global HVAC and FP market report 2021 till 2026. Must say, good info! I have not gone in depth at all parts, but got a good indication of the data inside!

Jason Lee

R&D Director, Seojin

Thanks for your great support. Appreciate it. Well received report. It helps us to understand market well. We're planning other area of survey in the future, let's keep in touch.

Akif Moroglu

Strategy & Business Development Director, Dogan Holding

We got the report in time, we really thank you for your support in this process. I also thank to all of your team as they did a great job.

Siliconware Precision Industries Co. Ltd

Company Headquarters: Taiwan Founded: 1984 Workforce: ~24,000 Company Overview: Siliconware Precision Industries Co. Ltd (SPIL) is engaged in the provision of semiconductor packaging, assembly, testing, and bumping services. Its assembly services include IC packaging processes for chipsets. SPIL also provides in-house design and consultation services. The company's test services are used to validate the assembly process by utilizing testing solutions for a range of digital and mixed signal devices. The bumping services include direct bumping, re-passivation, redistribution, wafer level CSP, and gold bumping services. Apart from this, the company offers packaging and testing solution including substrate packages and lead-frame packages with either wire bond or flip chip interconnections. The company also uses technologies such as wafer thinning, wire bonding, stacked-die bonding, wafer bumping, fine-pitch, and flip-chip assembly for developing packages including quad- plastic ball grid array (PBGA), thin and fine-pitch ball grid array (TFBGA), stacked-die chip scale package (CSP), flat no-leads (QFN), wafer level chip scale package (WLCSP), memory card, and flip chip ball grid array (FCBGA). The application of these packages could be observed in personal computers, consumer products, hand-held products, and wire communications. The company’s product portfolio comprises ball grid array, chip scale, stacked die, memory cards, and quad and dual leaded packages. The company's subsidiaries include SPIL (B.V.I.) Holding Limited, Siliconware US Inc., SPIL (Cayman) Holding Limited, and Siliconware Technology (Suzhou) Limited. Geographically, the company offers its solutions to the US, China, Taiwan, Europe, and other regions.

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